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Material: FR4-S1000-2 Number of layers: 2 layers Process: Gold-plated 30U" Minimum drilling: 0.25mm Minimum line width: 0.5mm Minimum line space: 0.5mm Feature: Electric thick gold 30U", need insulation 500MΩ@500VDC, withstand voltage
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Electric thick gold PCB | |||
Substrate: | FR4-S1000-2 | Layers: | 2 layers |
Dielectric constant: | 4.3 | Board thickness: | 2.0mm |
Thickness of outer copper foil: | 1oz | hickness of inner copper foil: | / |
Surface treatment method: | gold-plated 30U" | Minimum hole diameter: | 0.25mm |
Minimum line width: | 0.5mm | Minimum line space: | 0.5mm |
Application areas: | slip ring | Features: | Electric thick gold 30U", need insulation 500MΩ@500VDC, withstand voltage ≥500VAC@50HZ, do not accept oil supply line |
Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.