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Gold finger pcb

Material: FR4 Number of layers: 6 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: impedance board, gold finger electric thick gold, precise line width and line spacing

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Gold finger pcb
Substrate:  FR4 Layers:  6 layers
Dielectric constant:  4.3 Board thickness:  1.6mm
Thickness of outer copper foil:  1oz Inner copper foil thickness: 1oz
Surface treatment method:  Immersion gold Minimum hole diameter:  0.2mm
Minimum line width:  0.1mm Minimum line space:  0.1mm
Application areas:  Medical Features:  Impedance board, gold finger electrically thick gold, precise line width and line spacing


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Widely used in: communications, consumer electronics, industrial control, security, automobiles, power supplies, smart home, medical, military and other industries.

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