Material: FR4-S1000-2M
Number of layers: 12 layers Process: Immersion Gold
Minimum drilling: 0.25mm
Minimum line width: 0.1mm
Minimum line space: 0.1mm
Features: high-level impedance board, line width and line spacing 4mil 【MORE】
Material: FR4-S1000-2 Number of layers: 10 layers
Process: Immersion Gold
Minimum drilling: 0.25mm
Minimum line width: 0.1mm
Minimum line space: 0.1mm
Features: high-level PCB, impedance board, via plug holes are not allowed to redden 【MORE】
Material: FR4
Number of layers: 4 layers
Process: OSP
Minimum drilling: 0.4mm
Minimum line width: 0.2mm Minimum line spacing: 0.2mm
Features: black characters 【MORE】
Material: FR4
Number of layers: 6 layers
Process: Immersion Gold Min drilling hole: 0.3mm
Minimum line width: 0.127mm
Minimum line space: 0.127mm
Features: hole copper 25um, appearance IPC three-level standard, do not accept oil supply line 【MORE】
Material: FR4
Number of layers: 2 layers
Process: Immersion Gold
Minimum drilling hole: 0.25mm Minimum line width: 0.1mm
Minimum line space: 0.1mm
Features: hole copper 25um, gold fingers need beveled edges, and black oil bridges need to be retained 【MORE】
Material: FR4
Number of layers: 6 layers
Process: Immersion Gold
Minimum drilling: 0.25mm
Minimum line width: 0.1mm
Minimum line space: 0.1mm
Features: Impedance gold plate, size tolerance +/-0.1mm, USB card slot position tolerance is strict, via hole 【MORE】