Countersink circuit board

Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.15mm Minimum line width: 0.1MM Minimum line space: 0.1MM 【MORE】

Special half hole circuit board

Board used: Shengyi Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.8MM Surface treatment method: Immersion gold Gold thickness: 1U" Minimum line width: 0.1MM 【MORE】

Mixed voltage circuit board

Plate used: Shengyi FR4+ Rogers 4350B Dielectric constant: 3.5 Number of layers: 10 layers Board thickness: 1.6MM Surface treatment method: Immersion gold Minimum line width: 0.2MM Minimum line space: 0.2MM Special process: Shengyi FR4+ Roger 【MORE】

Immersion gold circuit board

Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.3mm 【MORE】

Communication PCB

Purpose: Communication Number of layers: 10L Plate: 1.6mm Copper thickness: 1OZ inside and outside The smallest hole: 0.2mm Impedance: 50Ω/100Ω/90Ω TG value: 170 【MORE】

Medical equipment FR4 Shengyi PCB

Substrate: FR4 Shengyi layers: 6 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Minimum hole diameter: 0.2mm 【MORE】

FR4 halogen-free multilayer circuit board

Substrate: FR4 halogen-free Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.35MM Surface treatment method: OSP Minimum line width: 0.127MM Minimum line space: 0.127MM Special process: plate thickness ≤0.35mm 【MORE】

Buried Hole HDI Automotive Circuit Board

Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 0.5oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.01MM Minimum line space: 0.08MM 【MORE】