Industrial Control PCB

Material: FR4 Number of layers: 4 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.15mm Minimum line space: 0.15mm Features: matt green ink, strict appearance requirements 【MORE】

High TG impedance board

Material: Shengyi S1000-2 Number of layers: 10 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: Need to control single-ended differential impedance, line width and line spacing are precise, BGA via plugs do not allow false 【MORE】

Smart watch PCB

Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.6mm Thickness of inner and outer copper foil: 1oz Surface treatment method: electric gold Minimum hole diameter: 0.2mm Minimum line space: 0.127MM 【MORE】

Half hole module board

Substrate: FR4 Shengyi Number of layers: 6 layers Dielectric constant: 4.2 Board thickness: 1.0mm Thickness of inner and outer copper foil: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.2mm 【MORE】

Four-layer spray tin circuit board

Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.3mm 【MORE】

High-end mechanical watch movement pcb

Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.6mm Thickness of inner and outer copper foil: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.1mm Minimum line space: 0.1MM 【MORE】

Type-c circuit board

Substrate: FR4 KB Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.8MM+/-0.05mm Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm 【MORE】

Medical high stability PCB board

Substrate: FR4 Shengyi S1000-2 Number of layers: 12 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold 【MORE】

Huawei Program Control Switch Communication Circuit Board

Substrate: FR4 Shengyi S1000-2 Number of layers: 12 layers Dielectric constant: 4.2 Board thickness: 2.0MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold 【MORE】