Board thickness: 3.0mm Thickness of outer copper foil: 4oz Inner copper foil thickness: 4oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.5mm Minimum line width: 1.0MM Minimum line space: 1.0MM 【MORE】

Plate used: TACONIC Number of layers: 2 layers Board thickness: 0.8MM Surface treatment method: Shen tin Minimum line width: 0.7MM Minimum line space: 0.25MM Special process: high frequency board, Teflon material 【MORE】

Uses: consumer electronics printers Number of layers: 2L Plate: Shengyi Board thickness: 0.25mm Copper thickness: 10Z Process: Immersion Gold 【MORE】

Purpose: communication consumer Number of layers: 2L Plate: Shengyigao TG Plate thickness: 0.3mm Copper thickness: 10Z Process: Immersion Gold 【MORE】

Sheet: FR4 Shengyi Board thickness: 1.6 Outer copper thickness: 1 ounce Minimum hole diameter: 0.3mm Minimum line width: 0.2mm Minimum line space: 0.2mm Product process: lead-free tin spray 【MORE】

Plate used: Teflon Dielectric constant: 3.5 Number of layers: 4 layers Board thickness: 1.0MM Surface treatment method: Shen tin Special process: high frequency board Minimum line width: 0.3MM Minimum line space: 0.25MM 【MORE】