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Material: FR4 Number of layers: 2 layers Process: Immersion Gold Min drilling hole: 0.3mm Minimum line width: 0.5mm Minimum line space: 0.5mm Features: Irregular shape, complicated gong board technology, strict size control, orange ink 【MORE】
Material: RO4350B Number of layers: 2 layers Process: Immersion Gold Minimum drilling: 0.5mm Minimum line width: 0.5mm Minimum line space: 0.5mm Features: ceramic plate, plate RO4350B 【MORE】
Substrate: FR4-S1000-2 Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 3oz Surface treatment method: electric gold Minimum hole diameter: 0.3mm 【MORE】
Substrate: FJY255A Number of layers: 2 layers Dielectric constant: 2.55 Board thickness: 0.8mm Thickness of outer copper foil: 1oz Surface treatment method: Shen tin Minimum hole diameter: 0.5mm 【MORE】
Substrate: FR4 Shengyi TG170 Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 4oz Surface treatment method: Immersion gold Minimum hole diameter: 0.5mm 【MORE】
Substrate: FR4 Hongren Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 0.8mm Outer copper foil thickness: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.3mm 【MORE】
Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.3mm Minimum line width and distance: 0.2MM 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.28MM Minimum line space: 0.12MM 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.3mm Minimum line width: 0.2MM Minimum line space: 0.2MM 【MORE】