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Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.6mm inner and outer copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.1mm 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.28MM Minimum line space: 0.12MM Gold thickness: 2U" 【MORE】
Board thickness: 3.0mm Thickness of outer copper foil: 4oz Inner copper foil thickness: 4oz Surface treatment method: lead-free spray tin Minimum hole diameter: 0.5mm Minimum line width: 1.0MM Minimum line space: 1.0MM 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner layer copper foil thickness: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.15mm Minimum line width: 0.1MM Minimum line space: 0.1MM 【MORE】
Board used: Shengyi Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.8MM Surface treatment method: Immersion gold Gold thickness: 1U" Minimum line width: 0.1MM 【MORE】
Plate used: Shengyi FR4+ Rogers 4350B Dielectric constant: 3.5 Number of layers: 10 layers Board thickness: 1.6MM Surface treatment method: Immersion gold Minimum line width: 0.2MM Minimum line space: 0.2MM Special process: Shengyi FR4+ Roger 【MORE】
Substrate: FR4 KB Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 1oz Surface treatment: Immersion gold Minimum hole diameter: 0.3mm 【MORE】
Purpose: Communication Number of layers: 10L Plate: 1.6mm Copper thickness: 1OZ inside and outside The smallest hole: 0.2mm Impedance: 50Ω/100Ω/90Ω TG value: 170 【MORE】
Substrate: FR4 Shengyi layers: 6 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Minimum hole diameter: 0.2mm 【MORE】