Substrate: FR4 halogen-free Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.35MM Surface treatment method: OSP Minimum line width: 0.127MM Minimum line space: 0.127MM Special process: plate thickness ≤0.35mm 【MORE】

Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 0.5oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.01MM Minimum line space: 0.08MM 【MORE】