Nickel Palladium Gold PCB

Material: FR4-S1000-2M Number of layers: 2 layers Process: Nickel Palladium Minimum drilling hole: 0.25mm Minimum line width: 0.127mm Minimum line space: 0.127mm Features: hole copper 25um, inspection under 20 times microscope does not allow the pad to be dirty 【MORE】

Electric thick gold PCB

Material: FR4-S1000-2 Number of layers: 2 layers Process: Gold-plated 30U" Minimum drilling hole: 0.25mm Minimum line width: 0.5mm Minimum line space: 0.5mm Features: Electric thick gold 30U", insulation 500MΩ@500VDC, withstand voltage 【MORE】

Coil pcb

Material: FR4 Number of layers: 6 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.08mm Minimum line spacing: 0.08mm Features: Coil board, each of the six layers is a coil 【MORE】

Smart watch PCB

Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 0.6mm Thickness of inner and outer copper foil: 1oz Surface treatment method: electric gold Minimum hole diameter: 0.2mm Minimum line width and distance: 0.127MM 【MORE】

Yin and Yang copper circuit board

Material: FR4-TG170 Number of layers: 10 layers Process: Immersion Gold Minimum drilling: 0.2mm Minimum line width: 0.1mm Minimum line space: 0.1mm Features: Yin and Yang copper foil thickness 【MORE】

Electric thick gold pcb

Substrate: FR4-S1000-2 Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 1.6mm Thickness of outer copper foil: 3oz Surface treatment method: electric gold Minimum hole diameter: 0.3mm 【MORE】

High frequency circuit board

Substrate: FJY255A Number of layers : 2 layers Dielectric constant: 2.55 Board thickness: 0.8mm Thickness of outer copper foil: 1oz Surface treatment method: Shen tin Minimum hole diameter: 0.5mm Minimum line width and distance: 1.18/0.32MM 【MORE】

Half hole module board

Substrate: FR4 Shengyi Number of layers: 6 layers Dielectric constant: 4.2 Board thickness: 1.0mm Thickness of inner and outer copper foil: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.2mm 【MORE】

Halogen-free thick gold half-hole circuit board

Substrate: FR4 Hongren Number of layers: 2 layers Dielectric constant: 4.2 Board thickness: 0.8mm Outer copper foil thickness: 1oz Surface treatment method: Immersion gold 3U" Minimum hole diameter: 0.3mm 【MORE】