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Plate used: Shengyi FR4+ Rogers 4350B Dielectric constant: 3.5 Number of layers: 10 layers Board thickness: 1.6MM Surface treatment method: Immersion gold Minimum line width: 0.2MM Minimum line space: 0.2MM 【MORE】
Substrate: FR4 KB Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 3.2MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: lead-free spray tin 【MORE】
Substrate: FR4 Hongren Number of layers: 4 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold 【MORE】
Substrate: FR4 Shengyi Shelf: 6 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Minimum hole diameter: 0.2mm 【MORE】
Substrate: FR4 Hongren Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 2oz Inner layer copper foil thickness: 2oz Surface treatment method: Immersion gold 【MORE】
Substrate: FR4 KB Shelf: 4 layers Dielectric constant: 4.2 Board thickness: 3.2MM Thickness of outer copper foil: 1oz Thickness of inner copper foil: 1oz Surface treatment method: lead-free spray tin 【MORE】
Purpose: Communication Number of layers: 10L Plate: 1.6mm Copper thickness: 1OZ inside and outside the smallest hole: 0.2mm Impedance: 50Ω/100Ω/90Ω TG value: 170 【MORE】
Substrate: FR4 halogen-free Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.35MM Surface treatment method: OSP Minimum line width: 0.127MM Minimum line space: 0.127MM 【MORE】
Plate used: Teflon Dielectric constant: 3.5 Number of layers: 4 layers Board thickness: 1.0MM Surface treatment method: Shen tin Special process: high frequency board Minimum line width: 0.3MM 【MORE】