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Material: FR4-Shengyi S1000-2 Number of layers: 8 layers Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm 【MORE】
Material: FR4-Shengyi S1000H Number of layers: 8 layers Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm 【MORE】
Material: FR4 Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.1MM 【MORE】
Material: FR4 Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: OSP Minimum hole diameter: 0.2mm Minimum line width: 0.1MM Minimum line distance: 0.1MM 【MORE】
Material: FR4 Number of layers: 8 layers Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 0.5oz Surface treatment method: Immersion gold Minimum hole diameter: 0.2mm Minimum line width: 0.01MM Minimum line distance: 0.08MM 【MORE】
Substrate: FR4 Shengyi Dielectric constant: 4.2 Board thickness: 1.6MM Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: gold finger Minimum hole diameter: 0.2mm 【MORE】
Dielectric constant: 4.2 Thickness of outer copper foil: 1oz Inner copper foil thickness: 1oz Surface treatment method: Immersion gold Minimum hole diameter: 0.15mm Minimum line width: 0.1MM Minimum line space: 0.1MM 【MORE】
Board used: Shengyi Dielectric constant: 4.5 Number of layers: 4 layers Board thickness: 0.8MM Surface treatment method: Immersion gold Gold thickness: 1U" Minimum line width: 0.1MM 【MORE】